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Intel Partners with Option to Bring Menlow to WWAN Modules
Mobie Internet Devices to have next-gen Intel chips in early 2008.
By Mike Spitalieri
Posted: 08.06.2007
Filed Under: Tech Industry News
a d v e r t i s e m e n t Intel and Option today announced a partnership to develop and optimize WWAN modules for Mobile Internet Devices, or MIDs, based on Intel's Menlow and McCaslin low-power technologies. MIDs provide full Internet experience on the go without the relative bulk of a laptop.
Currently, there are two modules in development and will be optimized for MIDs based on Intel's Silverthorne and Poulsbo low-power processors and chipsets. The GTM 201 module, for EDGE data networks, and GTM501, the 3G HSPA module, are planned for the first half of 2008.
Info: www.intel.com
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